Products
Mold Releases
Epoxease Mold Release (No. 406)
- Non-silicone, synthetic wax-based product
- For epoxy, polyester and phenolic resins
- For injection molding, encapsulating, potting
- No chlorinated solvents
- Maximum operating temp: 450°F/232°C
- Bulk versions of this product should be thoroughly stirred prior to use
EpoxEase is a synthetic wax-based, non-silicone release. It is formulated to prevent the sticking commonly seen when using all-purpose release agents on epoxies, to maximize your productivity. Ideal for use on epoxy, polyester and phenolic resins and most often utilized in encapsulating and potting applications.
Continually improving products include systems for manifolds, mold alignment and ejector tie-ins, limit switches, hot water and hot oil manifolds.
Using patent technology, IPS Moldshields prevent parts from falling outside the molding area. IPS also offers Mold Chutes, Skirts, Tie-Bar covers and Drum / Gaylord Covers.
